物料参数
| Product Lifecycle: | 量产 |
| Package: | Wafer-Level Package 3x2 Bump, Full Array |
| # of Amps: | 1 |
| GBP (typ): | 9kHz |
| BW -3 dB (typ): | 9kHz |
| Slew Rate (typ): | 2mV/us |
| Vos (max): | 7mV |
| VNoise Density (typ): | 120nV/rtHz |
| Ibias (max): | 1.5nA |
| Rail to Rail: | Output |
| Iq/Amp (typ): | 750nA |
| Iq/Amp (max): | 1.2µA |
| Vs span (min): | 1.8V |
| Vs span (max): | 5.5V |
| Shutdown: | No |
| Eval / Ref Circuit: | Evaluation board |
| Export Classification: | EAR99 |
| Automotive: | No |
| Temp Range: | -40 to 85°C |
| Package Finish Code: | E1 |
| Launch Date: | 2011-01-07 |
| Terminal Finish: | E1 |
| Temp Range Code: | E |
| EP: | No |
| Design Tools: | LTspice |
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